Composite materials least prone to cracking under mechanical and thermal loads

Karihaloo, Bhushan Lal ORCID: https://orcid.org/0000-0003-0657-2678 and Wang, J. 2001. Composite materials least prone to cracking under mechanical and thermal loads. Presented at: Proceedings 10th International Conference Fracture (ICF10), Honolulu, USA, Published in: K Ravi-Chandar Bhushan L, Karihaloo ed. (CD-ROM)

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Item Type:	Conference or Workshop Item (Paper)
Schools:	Engineering
Last Modified:	19 Oct 2022 09:23
URI:	https://orca.cardiff.ac.uk/id/eprint/20954

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