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Investigation of various envelope complexity linearity under modulated stimulus using a new envelope formulation approach

Ogboi, Friday Lawrence, Tasker, Paul J., Akmal, Muhammad, Lees, Jonathan, Benedikt, Johannes, Bensmida, S., Morris, K., Beach, M. and McGeehan, J. 2014. Investigation of various envelope complexity linearity under modulated stimulus using a new envelope formulation approach. Presented at: 83rd ARFTG Microwave Measurement Conference 2014, Tampa, USA, 1 - 6 June 2014. Compound Semiconductor Integrated Circuit Symposium (CSICs), 2014 IEEE. IEEE, pp. 1-4. 10.1109/CSICS.2014.6978563

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Abstract

In [1] a new formulation for quantifying the linearizing baseband voltage signal, injected at the output bias port, to linearize a device behaviour was introduced. A key feature of this approach is that since it is formulated in the envelope domain the number of linearization coefficient required is independent of the envelope shape, complexity. This property is validated by performing baseband linearization investigations on a 10W Cree GaN HEMT device. Modulated signals with increasing complexity 3, 5, and 9-tone modulated stimulus, at 1.5dB of compression, were utilized. In all cases just two-linearization coefficients needed to be determined in order to compute the output baseband signal envelope necessary. Intermodulation distortion was reduced to around -50dBc, a value very close to the dynamic range limit of the measurement system.

Item Type: Conference or Workshop Item (Paper)
Date Type: Publication
Status: Published
Schools: Engineering
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Publisher: IEEE
ISBN: 9781479936229
Last Modified: 10 Oct 2017 16:11
URI: http://orca.cf.ac.uk/id/eprint/68799

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