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DC-50 GHz low loss thermally enhanced low cost LCP package process utilizing mico via technology

Aboush, Z., Benedikt, Johannes ORCID: https://orcid.org/0000-0002-9583-2349, Priday, J. and Tasker, Paul ORCID: https://orcid.org/0000-0002-6760-7830 2006. DC-50 GHz low loss thermally enhanced low cost LCP package process utilizing mico via technology. Presented at: 2006 IEEE Microwave Symposium, San Francisco, USA, pp. 961-964.

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Item Type: Conference or Workshop Item (Paper)
Schools: Engineering
Last Modified: 17 Oct 2022 10:16
URI: https://orca.cardiff.ac.uk/id/eprint/7594

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